September 4, 2014
Driven by the demands of miniaturization, the goal of High Density Interconnect (HDI) technology is to facilitate new designs requiring smaller footprints and ultra-dense and precise conductor geometries. Flex based materials enable smaller application form factors with the benefit of reduced weight and optimized packaging utilization. High density via fabrication dramatically increases the I/O count. With advances in materials and etching technologies, high density flex geometries are attainable.
PFC has been a leader in HDI flex circuit technology for over 9 years and can provide 50 micron lines and space and as small as 50 micron holes. Material choices play an important role in PFC’s ability to produce HDI flex cost effectively and our keen understanding of key materials, etching processes and design allows us to continue to advance the technology.