Qualification, troubleshooting and failure analysis

Process qualification, trouble shooting and failure analysis are key services that PFC offers its customers. You will find that PFC’s competitors will have you send samples out to a third party for analysis. PFC has some of the greatest analysis equipment right on the PFC premises!

Sentec logoPFC’s partner, SenTec, offers SEM (scanning electron microscope), X-Ray EDS Microanalysis (energy-dispersive x-ray), and FTIR (Fourier transform infrared spectroscopy) technology. These tools are powerful and indispensable for failure analysis, troubleshooting and process verification.

The microscopy is ideal for high magnification imaging (well above the magnification limit of light microscopy of 1000-1500x), while EDS microanalysis is used to identify the elemental composition of the material of interest. The technique is particularly useful for identification of inorganic substances. The FTIR can identify organic materials.

Use cases Tests/analyses involved
Process Qualification/Verification
Pb-free assembly
Mixed technology
Clean or no-clean process
SMT or wave soldering
Visual and x-ray inspection
FTIR – identifies organic materials
Cross-sectioning
Light and scanning electron microscopy
New Vendor/Component Qualification
Printed wire boards
Components
Material
Lating integrity
Assembly
Visual inspection
Thermal stress (solder flow)
Cross-sectioning
Light and scanning electron microscopy
DSC and TGA
Troubleshooting
Residue on the assembly
Solderability issue
Brittle fracture and black pad
Opens, shorts, leakage
Visual and x-ray inspection
FTIR – identifies organic materials
SEM/EDS
Cross-sectioning
Failure Analysis
Assembly failures
Material related failures
Process related failures
Handling related failures
Environmental failures
Visual inspection and x-ray inspection
Acoustic microscopy
Cross-sectioning and parallel lapping
Light and scanning electron microscopy
FTIR, DSC and TGA
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