Flexible circuits, rigid flex, and flex circuit assemblies Product Analysis

Highlights

  • Prototypes and production quantities
  • HDI- 50 micron trace and space in production
  • Micro vias-50 microns
  • Full SMT and hand assembly in-house
  • Up to 18 layers

Engineering and design

Materials

  • LF, FR, (Dupont) adhesiveless clads
  • All polyimide constructions
  • Beryllium copper and nickel alloys
  • Dynamic flex circuits with rolled and annealed copper
  • Up to 16 oz copper for high power applications

Assembly

  • Turnkey or consignment options availableassembly services
  • Sub-assemblies and box builds

Manufacturing

  • LDI (Laser Direct Imaging)
  • Optical “smart drills”
  • Folding and heat sinks

Plating

  • Immersion tinmanufacturing services
  • Wire bondable gold
  • HASL
  • Hard gold
  • Immersion gold
  • Selective thru hole pad plating / button plate

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