Materials PFC Approved
Insulating Materials Polyimide
Clad Materials DuPont / Espanex, Panasonic
Adhesiveless Materials DuPont AP, Panasonic,
Espanex
Coverfilm/ Covercoat/ Coverlay Kapton (Pyralux)
Espanex, DuPont- Black, Taiflex- Black and White
High Speed Laminates TK- DuPont, Taconic
Flexible Solder Mask Various per IPC-840 Class 3
Rigid Solder Mask Taiyo PSR
Metals Copper 9-750 micron (.0008 – .030) thick.
Beryllium Copper
Nickel Alloys
Finishes Immersion gold over Electroless nickel
Immersion Tin
Hot air solder level (tin-lead)
Hard gold
Soft gold
OSP (Organic Solderability Preservative)
Shielding Materials Copper Silver paste/ink
Tatsuta
Stiffeners Polyimide, Machined Metal
Aluminum (cast)
Ceramic
FR-4, Black FR-4
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