Driven by market demand for new applications requiring smaller interconnects with dense components, HDI technology increases density by miniaturization of holes, pads, and conductors to create a smaller interconnect solution. Read more about PFC’s HDI capabilities.
The medical market for flex circuits continues to be strong. Read more about the trends driving this growth and the solutions PFC provides to support it.
Frustrations exist in the industry with the lack of readily available industry information on high speed flex. Read more about why that information gap exists and how PFC is bridging it.
Wondering about the differences between Rolled Annealed (RA) copper and Electro Deposited (ED) Copper in flex circuit design? Get some answers here.
The white paper jointly presented by DuPont, Taconic and PFC Flexible Circuits Limited in the technical sessions at DesignCon 2016 is now available for download. Read more here.
HDI flex requires the flex circuit vendor to design, manufacture and assemble. This is what PFC provides. Read more about HDI and PFC’s capabilities here.
Why are flex circuits superior for high frequencies? What you need to know about high speed flex solutions and how PFC can help.
Why are there tooling charges for a flex circuit? Read more about non-recurring engineering costs here.
Driven by the demands of miniaturization, the goal of High Density Interconnect (HDI) technology is to facilitate new designs requiring smaller footprints and ultra-dense and precise conductor geometries.
Learn more about what PFC requires when you are submitting projects to us for quotation.